Browsing Материалы конференции по статьям by Author "Кушнер, Л. К."
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Металлизация отверстий при создании межсоединений элементов ИМС
Кушнер, Л. К.; Кузьмар, И. И.; Степанова, Л. И.; Лазарук, С. К.; Василец, В. К.; Хмыль, А. А. (БНТУ, 2015)Metall filling of Through Silicon Vias (TSV), as one of the critical and enabling technologies for Three Dimensional Packaging, is presented in this paper. Copper electroplating techniques are investigated for the filling and metallization of vias. The results are demonstrated in this paper.2018-05-03 -
Формирование трехмерных микроструктур методом электроосаждения
Кушнер, Л. К.; Кузьмар, И. И.; Василец, В. К.; Купо, А. Н.; Хмыль, А. А. (БНТУ, 2015)The results of research principles of electrochemical filling topological trenches depending on the nickel and copper electrolyte composition, were demonstrated. Besides the physical and chemical laws of formation of copper 3D-microstructures using the periodic current and ultrasonic, were researched.2018-05-03