Control of Integrated Circuits Crystals' Surface Microrelief and Defects of Hetero- and Submicrostructures by the Atomic Force Microscopy Method

Abstract

The aim of the work was to study the structure and defects of a channel transistor with two types of conductivity (p and n), the submicrostructures based on nickel silicide films, and the seed layers based on AlN using atomic force microscopy (including conductive or electric force method, which allow one to study the electrical conductivity of the material surface). The influence of the manufacturing technology and local oxide formation on the relief and structure of the p- and n-type transistor was established. The local oxide is necessary for the electrical isolation of the transistors from each other. The surface roughness is higher on the surface and outside the p-channel transistor than on the n-channel transistor. When examining the AlN layers both in the topography mode and in the adhesion mode, defects in the form of pores were revealed, which are places of electrical breakdowns, which worsens the properties of the such heterostructures. With an increase in the temperature and time of nitriding, the defects of the AlN layers significantly decrease. The conductive areas on the surface of the nickel silicides after rapid thermal treatment at 300 and 400 °C using electric force microscopy were detected, which shows incomplete formation of nickel silicide during the treatment. Thus, the efficiency of the atomic force microscopy method using a specialized conductive technique as a method for monitoring microelectronic components was demonstrated.