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    • Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure 

      Barbin, E. S.; Kulinich, I. V.; Nesterenko, T. G.; Koleda, A. N.; Shesterikov, E. V.; Baranov, P. F.; Il’yaschenko, D. P. (БНТУ, 2024)
      Modern microelectromechanical systems (MEMS) are devices that incorporate microelectronic components and micromechanical structures on a single chip. Packaging is a mandatory stage in MEMS manufacturing. It ensures mechanical protection, sealing and transmission of electric energy and signals. The present work was aimed at developing a MEMS packaging method as a part of the ...
      2024-12-13