Now showing items 1-2 of 2

    • Optimization of the Optical Measuring Converter’s Geometric Properties for the Microelectromechanical Pressure Sensor 

      Barbin, E. S.; Nesterenko, T. G.; Baranov, P. F.; Ilyaschenko, D. P.; Vtorushin, S. E.; Talovskaya, A. A.; Mokhovikov, D. M.; Koleda, A. N.; Myrzakhmetov, A. (БНТУ, 2026)
      Nowadays development and production of microelectromechanical systems is one of the most promising directions in the world's economy. One of the innovative fields in the development of microsystems is integration of optical devices as measuring transducers. Goal of the paper is optimization of the optical measuring transducer geometry for microelectromechanical pressure sensor ...
      2026-04-17
    • Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure 

      Barbin, E. S.; Kulinich, I. V.; Nesterenko, T. G.; Koleda, A. N.; Shesterikov, E. V.; Baranov, P. F.; Il’yaschenko, D. P. (БНТУ, 2024)
      Modern microelectromechanical systems (MEMS) are devices that incorporate microelectronic components and micromechanical structures on a single chip. Packaging is a mandatory stage in MEMS manufacturing. It ensures mechanical protection, sealing and transmission of electric energy and signals. The present work was aimed at developing a MEMS packaging method as a part of the ...
      2024-12-13