Browsing by Author "Baranov, P. F."

Now showing items 1-5 of 5

    • A Concept of an Integral Optical Pressure Sensor 

      Barbin, E. S.; Baranov, P. F.; Ilyaschenko, D. P.; Nesterenko, T. G.; Vtorushin, S. E.; Talovskaya, A. A. (БНТУ, 2025)
      Today, an expanding application of automatic systems demands research and development of novel types of sensors suitable for special conditions. Specifically, microelectromechanical pressure sensors are among of the most widely implemented devices. A pressure sensor comprises a silicon membrane that deforms under pressure of the medium and a measuring transducer that converts the ...
      2026-01-05

    • Designing a Planar Fluxgate Using the PCB Technology 

      Kolomeitsev, A. A.; Zatonov, I. A.; Pischanskaya, M. I.; Baranov, P. F.; Ilyaschenko, D. P.; Verkhoturova, E. V. (БНТУ, 2021)
      The development of novel methods, scientific devices and means for measuring magnetic fields generated by ultra-low current is among promising directions in the development of medical equipment and instruments for geodetic surveys and space exploration. The present work is to develop a small sensor capable of detecting weak magnetic fields, which sources are biocurrents, radiation ...
      2021-07-07

    • Optimization of the Optical Measuring Converter’s Geometric Properties for the Microelectromechanical Pressure Sensor 

      Barbin, E. S.; Nesterenko, T. G.; Baranov, P. F.; Ilyaschenko, D. P.; Vtorushin, S. E.; Talovskaya, A. A.; Mokhovikov, D. M.; Koleda, A. N.; Myrzakhmetov, A. (БНТУ, 2026)
      Nowadays development and production of microelectromechanical systems is one of the most promising directions in the world's economy. One of the innovative fields in the development of microsystems is integration of optical devices as measuring transducers. Goal of the paper is optimization of the optical measuring transducer geometry for microelectromechanical pressure sensor ...
      2026-04-17

    • Silicon Nitride-on-Insulator Photonics Polarisation Convertor 

      Mokhovikov, D. M.; Barbin, E. S.; Nesterenko, T. G.; Talovskaya, A. A.; Myrzakhmetov, A. S.; Kulinich, I. V.; Baranov, P. F.; Il’yaschenko, D. P. (БНТУ, 2024)
      Photonic integrated circuits constitute a vital component of contemporary telecommunications systems, facilitating traffic management and reducing energy consumption. However, the integration of these components presents a significant challenge in the form of high polarization sensitivity, which has the potential to limit the overall performance of the device. The objective of ...
      2024-12-13

    • Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure 

      Barbin, E. S.; Kulinich, I. V.; Nesterenko, T. G.; Koleda, A. N.; Shesterikov, E. V.; Baranov, P. F.; Il’yaschenko, D. P. (БНТУ, 2024)
      Modern microelectromechanical systems (MEMS) are devices that incorporate microelectronic components and micromechanical structures on a single chip. Packaging is a mandatory stage in MEMS manufacturing. It ensures mechanical protection, sealing and transmission of electric energy and signals. The present work was aimed at developing a MEMS packaging method as a part of the ...
      2024-12-13