Browsing by Author "Baranov, P. F."

Now showing items 1-3 of 3

    • Designing a Planar Fluxgate Using the PCB Technology 

      Kolomeitsev, A. A.; Zatonov, I. A.; Pischanskaya, M. I.; Baranov, P. F.; Ilyaschenko, D. P.; Verkhoturova, E. V. (БНТУ, 2021)
      The development of novel methods, scientific devices and means for measuring magnetic fields generated by ultra-low current is among promising directions in the development of medical equipment and instruments for geodetic surveys and space exploration. The present work is to develop a small sensor capable of detecting weak magnetic fields, which sources are biocurrents, radiation ...
      2021-07-07

    • Silicon Nitride-on-Insulator Photonics Polarisation Convertor 

      Mokhovikov, D. M.; Barbin, E. S.; Nesterenko, T. G.; Talovskaya, A. A.; Myrzakhmetov, A. S.; Kulinich, I. V.; Baranov, P. F.; Il’yaschenko, D. P. (БНТУ, 2024)
      Photonic integrated circuits constitute a vital component of contemporary telecommunications systems, facilitating traffic management and reducing energy consumption. However, the integration of these components presents a significant challenge in the form of high polarization sensitivity, which has the potential to limit the overall performance of the device. The objective of ...
      2024-12-13

    • Wafer-Level Packaging of Microelectromechanical Systems Based on Frame Structure 

      Barbin, E. S.; Kulinich, I. V.; Nesterenko, T. G.; Koleda, A. N.; Shesterikov, E. V.; Baranov, P. F.; Il’yaschenko, D. P. (БНТУ, 2024)
      Modern microelectromechanical systems (MEMS) are devices that incorporate microelectronic components and micromechanical structures on a single chip. Packaging is a mandatory stage in MEMS manufacturing. It ensures mechanical protection, sealing and transmission of electric energy and signals. The present work was aimed at developing a MEMS packaging method as a part of the ...
      2024-12-13