Now showing items 1-2 of 2

    • Influence of Temperature from 20 to 100 °C on Specific Surface Energy and Fracture Toughness of Silicon Wafers 

      Lapitskaya, V. A.; Kuznetsova, T. A.; Chizhik, S. A. (БНТУ, 2023)
      The influence of temperature in the range from 20 to 100 °C on the specific surface energy and fracture toughness of standard silicon wafers of three orientations (100), (110) and (111) was studied. Silicon wafers were heated on a special thermal platform with an autonomous heating controller, which was installed under the samples. At each temperature, the samples were kept for ...
      2023-12-12
    • Methods for Accuracy Increasing of Solid Brittle Materials Fracture Toughness Determining 

      Lapitskaya, V. A.; Kuznetsova, T. A.; Chizhik, S. A.; Warcholinski, B. (БНТУ, 2022)
      Method for determining of the fracture toughness of brittle materials by indentation is described. The critical stress intensity factor KIC quantifies the fracture toughness. Methods were developed and applied to improve the accuracy of KIC determination due to atomic force microscopy and nanoindentation. It is necessary to accurately determine parameters and dimensions of the ...
      2022-04-06